• Static dissipative top and bottom layers
• Buried conductive layer
Consists of three layers, static dissipative top and
bottom surfaces and a conductive inner layer. The buried
conductive layer (103–104Ω) is inaccessible except through
a properly installed groundable snap. This feature reduces
potential for damage from a spark induced EMP and ensures
employee safety.
• Resistance to ground 1.0 x 109Ω
• Very high temperature resistance – resistant to solder
drips
• Meets or exceeds MIL-W-87893A, IEC 61340-5,
DOD-HDBK-263,DOD-STD-1686