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Multi Core

Multicore Solder Paste

SKU
56280
• Outstanding humidity resistance
• Superior slump resistance
• Excellent solderability
• Wide printing and reflow process windows
€45.76 €37.20

Description

• Outstanding humidity resistance.
• Superior slump resistance.
• Colourless, soft, non-stick, pin-testable residue.
• Optimised paste viscosity.
• Extended open time and tack life.
• Halide-free flux classificaiton.
• High tack force.
• Long printer abandon times.
• Excellent solderability.
• Wide printing and reflow process windows.

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