Consists of three layers, static dissipative top and bottom surfaces and a conductive inner layer. The buried conductive layer (103–104Ω) is inaccessible except through a properly installed groundable snap. This feature reduces potential for damage from a spark induced EMP and ensures employee safety
Resistance to ground 1.0 x 109Ω
Very high temperature resistance – resistant to solder drips
Meets or exceeds MIL-W-87893A, IEC 61340-5, DOD-HDBK-263,DOD-STD-1686