Multicore Lead-Free Solder Wire - 502
Part Number
Multicore Lead-Free Solder Wire - 502
- No clean
- Clear residue
- Increased wetting speed
- 955% SN, 38% Ag, 07% CU
Only %1 left
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Description
- No-clean, clear residue, minimal activation for increased wetting speed
- Composition: 95.5% SN, 3.8% Ag, 0.7% CU
- Halide Content: 0.2%
- IPC Class: ROM1
- Flux Content by Weight: 3%
Information